Microwave dielectric ceramics have the characteristics of low dielectric constant, high quality factor and near zero resonant frequency temperature coefficient, which can meet the development of microwave devices in the direction of miniaturization, low cost, integration and multi-function. The low temperature co-firing of microwave dielectric ceramics is an important way to meet the continuous development of microwave dielectric electronic components towards miniaturization, lightweight, high integration and high performance. In this paper, the methods of low temperature co-firing of microwave dielectric ceramics are introduced, and four methods of low temperature co-firing of microwave dielectric ceramics are introduced. |